{"id":903,"date":"2024-02-07T18:41:33","date_gmt":"2024-02-07T18:41:33","guid":{"rendered":"https:\/\/pc-keeper.tech\/index.php\/2024\/02\/07\/interconnects-for-chiplet-integration-technologies\/"},"modified":"2024-02-07T18:41:33","modified_gmt":"2024-02-07T18:41:33","slug":"interconnects-for-chiplet-integration-technologies","status":"publish","type":"post","link":"https:\/\/pc-keeper.tech\/index.php\/2024\/02\/07\/interconnects-for-chiplet-integration-technologies\/","title":{"rendered":"Interconnects for Chiplet Integration Technologies"},"content":{"rendered":"<p> [ad_1]<br \/>\n<\/p>\n<div style=\"font-family: Open Sans, sans-serif; position: relative; overflow: hidden;\">\n<h3>Important Dates<\/h3>\n<ul>\n<li><span style=\"font-weight: 400;\"><strong>Submission Deadline:<\/strong> 15 April 2024<\/span><\/li>\n<li><span style=\"font-weight: 400;\"><strong>Publication Date:<\/strong> November\/December 2024<\/span><\/li>\n<\/ul>\n<hr\/>\n<p><span style=\"font-weight: 400;\">As Moore\u2019s Law slows down, integrating more transistors and system components in a single monolithic die has become challenging and expensive. This has spurred innovations in chiplet integration technologies, including packaging and chiplet-to-chiplet interconnect technologies that can best exploit unique opportunities given by the chiplet technologies. Leading such a technology trend, the industry has already introduced volume products, connecting multiple chiplets with proprietary interconnect technologies. Meanwhile, the need to broaden the participation and ecosystem for chiplet integration technologies has also driven open standards for chiplet\u00a0interconnect technologies, such as Universal Chiplet Interconnect Express\u2122 (UCIe), High Bandwidth Memory (HBM), and extra short reach (XSR).\u00a0<\/span><\/p>\n<p><span style=\"font-weight: 400;\">This special issue of <\/span><i><span style=\"font-weight: 400;\">IEEE Micro <\/span><\/i><span style=\"font-weight: 400;\">seeks articles on broad topics that relate to recent chiplet-to-chiplet interconnect technologies, their impact on future processor, accelerator, and memory architectures, and their novel applications. Topics include, but are not limited to:<\/span><\/p>\n<ul>\n<li style=\"font-weight: 400;\" aria-level=\"1\"><span style=\"font-weight: 400;\">Chiplet-to-chiplet interconnect protocols and models.<\/span><\/li>\n<li style=\"font-weight: 400;\" aria-level=\"1\"><span style=\"font-weight: 400;\">Co-design of inter-chiplet, -package, and -system interconnect protocols.<\/span><\/li>\n<li style=\"font-weight: 400;\" aria-level=\"1\"><span style=\"font-weight: 400;\">Innovative processor, accelerator, and memory architectures, for various applications (e.g., automotive, AI, datacenter, etc.), exploiting chiplet integration and interconnect technologies.<\/span><\/li>\n<li style=\"font-weight: 400;\" aria-level=\"1\"><span style=\"font-weight: 400;\">Testability, manageability, reliability, and debuggability of chiplet-based designs.<\/span><\/li>\n<li style=\"font-weight: 400;\" aria-level=\"1\"><span style=\"font-weight: 400;\">Packaging technologies and challenges for chiplet-based designs.<\/span><\/li>\n<\/ul>\n<hr\/>\n<h3>Submission Guidelines<\/h3>\n<p><span style=\"font-weight: 400;\">For author information and guidelines on submission criteria, please visit\u00a0<\/span><i><span style=\"font-weight: 400;\">IEEE Micro<\/span><\/i><span style=\"font-weight: 400;\">\u2018s\u00a0Author Information page<\/span><span style=\"font-weight: 400;\">. Please submit papers through\u00a0<\/span><span style=\"font-weight: 400;\">the ScholarOne system<\/span><span style=\"font-weight: 400;\">, and be sure to select the special issue name. Manuscripts should not be published or currently submitted for publication elsewhere. Please submit only full papers intended for review, not abstracts, to the ScholarOne portal.<\/span><\/p>\n<hr\/>\n<h3>Questions?<\/h3>\n<p><strong>Contact the guest editors at <span style=\"font-weight: 400;\">micro6-24@computer.org<\/span> <\/strong><\/p>\n<ul>\n<li data-pm-slice=\"1 1 []\"><span style=\"font-weight: 400;\">Debendra Das Sharma, Intel, USA<\/span><\/li>\n<li data-pm-slice=\"1 1 []\"><span style=\"font-weight: 400;\">Nam Sung Kim, University of Illinois, Urbana-Champaign, USA<\/span><\/li>\n<\/ul>\n<p><span style=\"font-weight: 400;\">Editor-in-Chief Hsien-Hsin Sean Lee<\/span><\/p>\n<\/p><\/div>\n<p>[ad_2]<br \/>\n<br \/><a href=\"https:\/\/www.computer.org\/digital-library\/magazines\/mi\/interconnects-for-chiplet-integration-technologies\">Source link <\/a><\/p>\n","protected":false},"excerpt":{"rendered":"<p>[ad_1] Important Dates Submission Deadline: 15 April 2024 Publication Date: November\/December 2024 As Moore\u2019s Law slows down, integrating more transistors&hellip;<\/p>\n","protected":false},"author":1,"featured_media":904,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[486,703,733],"tags":[],"class_list":["post-903","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-call-for-papers","category-call-for-papers-filter-post","category-cfp-micro"],"_links":{"self":[{"href":"https:\/\/pc-keeper.tech\/index.php\/wp-json\/wp\/v2\/posts\/903","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/pc-keeper.tech\/index.php\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/pc-keeper.tech\/index.php\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/pc-keeper.tech\/index.php\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/pc-keeper.tech\/index.php\/wp-json\/wp\/v2\/comments?post=903"}],"version-history":[{"count":0,"href":"https:\/\/pc-keeper.tech\/index.php\/wp-json\/wp\/v2\/posts\/903\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/pc-keeper.tech\/index.php\/wp-json\/wp\/v2\/media\/904"}],"wp:attachment":[{"href":"https:\/\/pc-keeper.tech\/index.php\/wp-json\/wp\/v2\/media?parent=903"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/pc-keeper.tech\/index.php\/wp-json\/wp\/v2\/categories?post=903"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/pc-keeper.tech\/index.php\/wp-json\/wp\/v2\/tags?post=903"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}